Ceramic Substrate (DBC / DPC)
The reason for using ceramic
- Good mechanical strength : mechanically stable shape, good adhesion and corrosion resistance.
- Excellent electrical insulation.
- Efficient thermal conductivity.
- The thermal expansion coefficient is close to that of semiconductor, so no interface layers are required.
- Superb thermal cycling stability.
- Good heat distribution.
IGBT
TEC ( Thermoelectric Cooler )
IGBT
Automotive-Regulator
Automotive-Regulator
TEC ( Thermoelectric Cooler )
COB ( ASSMEBLE PCB )
Solar Cell ( HCPV )
Solar Cell ( HCPV )
Solar Cell ( HCPV )
LED
Multilayer Up to 160 um
500 um Cu Via Fillin
LED
8”wafer
High Cyanidation E-plating Ni/Ag
Ceramic Cavity
Epoxy dam with 400um