Thermal Release Film

Usage

• ◆ Used as temporary support plate for coreless substrate production or embedding wiring patterns in substrates.
• ◆ Used as support in the manufacturing process of FO-WLP.

Characteristics

• ◆ Heat resistant (above 120℃、140℃、200℃), chemical resistant, can handle weak alkali.
• ◆ Easy to peel with no glue residue problems.
• ◆ The film does not contain halogen and RoHS compliant harmful substances.

Appearance when heated

Types and Composition of Thermal Release Film

Single Sided Type

KA-S120： Debonding temperature 120℃
KA-S140： Debonding temperature 140℃
KA-S200： Debonding temperature 200℃

Double Sided Type

KA-D120： Debonding temperature 120℃
KA-D140： Debonding temperature 140℃
KA-D200： Debonding temperature 200℃

260℃ Release Sheet