SR Protection Film
This film (SR solder mask protection film) is mainly used in multi-layer PCB Boards after coating the SR, the film can remain while being exposed and peel off before Lithography process, Effectively decrease processing time and prevents oxidization while not being contaminated by FM: this is a countermeasure for FM, gloss effect, RA surface and parallel adjustment etc.
| Film thickness | More than 12μm |
| Adhesive thickness | More than 2μm |
| Adhesive | Can be customize |
| Transmittance | More than 90% |
Feature：
- ◆ Effectively prevent SR surface from FM contamination.
- ◆ Has a high transmittance, refractivity and effective exposure!
- ◆ Prevent oxidize and form perfect ring opening.
- ◆ Effectively flattening surface of SR.
- ◆ While process transfer, SR surface won't get damage easily.
- ◆ Can Customize according to adhesive thickness and roughness.
Peel after lamination：
- ◆ Easily peel off won’t have residue remain.
- ◆ Surface FM to the min., and easier to clean the surface after process.
Comparison DRY FILM vs.Liquid SR
| Liquid SR | DRY FILM SR | |
| Flattening | ○ | ○ |
| Productivity |  |
○ |
| Thickness | ○ | X |
| Storage Stability | ○(Liquid)(After mixing hardening solution) |
|
| Process Duration | |
○ |
| Price | Fair Price | Hight Price |
